S&E Electroplated Diamond Wire Saw

Our Electroplated Diamond Wire Saw utilizes advanced multi-layer technology, significantly surpassing the performance of traditional single-layer electroplated. This innovation ensures finer work, faster finishing, and greater efficiency, making these wheels ideal for high-precision grinding and cutting applications. The multi-layer design reduces processing time, enhances surface quality, and extends tool life, resulting in substantial cost savings. Trusted by leading industries for their superior performance and reliability, our electroplated diamond wire saw set the standard for excellence.

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Features
  • Wet and Dry Cutting
  • Multi-Layer Electroplated
  • Good abrasion
  • Heat resistance
  • Long tool life
  • Precision Cutting
  • Versatility
  • Efficiency
  • Surface Finish
  • Customizability
Technical Specs

Diamond grit size, specified based on the drawing/blueprint, will determine the tool's suitability for Cutting applications.

Range of Applications
Sic Ingot and Sapphire Crystal Ingot
Advance Electronics Parts
Ceramic Substrate Manufacture
Wafer Fabrication
Material Suitability
Silicon / Silicon Carbide
Glass / Optics
Sapphire, Quartz & Other Crystals
Ceramic Tile
Other Advanced Materials