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S&E Metal Bond Diamond Wheel (for Grinding)
Our Metal Diamond Wheels are engineered for precision grinding applications involving semiconductor and electronics parts. The metal bond ensures superior wear resistance and extended wheel life, making these wheels ideal for high-stress environments. They deliver consistent performance and precision, ensuring efficient material removal and excellent surface quality in industries such as semiconductor and electronics
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Features
- Wet Use
- Durability
- Heat Resistance
- Precision
- Material Removal
- Wear Resistance
- Surface Finish
Technical Specs
Diamond grit size, defined based on the drawing/blueprint, will determine whether the tool is used for grinding
Range of Applications
Sic and Sapphire Wafer
Advance Electronics Parts
Ceramic Substrate Manufacture
LED/LCD
IC Packaging
Micro LED/OLED
MEMC Device
PCB
Material Suitability
Ceramic Tile
Glass / Optics
Silicon / Silicon Carbide
Sapphire, Quartz & Other Crystals
Other Advanced Materials
Non-Ferrous Metals
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