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S&E Vitrified Bond Diamond Wheel (for Grinding)
Our Diamond Vitrified Bond Wheel is engineered for precision grinding applications, particularly in the semiconductor and electronics industries. The vitrified bond provides excellent rigidity and shape retention, ensuring consistent grinding performance even under high-pressure conditions. With superior thermal stability, this wheel minimizes thermal damage to the workpiece, delivering a high-quality surface finish with minimal chipping. Its long-lasting performance reduces downtime and operational costs, making it an ideal choice for grinding hard and brittle materials such as ceramics, tungsten carbide, and glass.
- Wet Grinding
- Stability
- Precision
- Heat Resistance
- Material Removal
- Durability
- Surface Finish
Diamond grit size, defined based on the drawing/blueprint, will determine whether the tool is used for grinding.
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