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S&E Vitrified Bond Diamond Wheel (for Polishing)
Our Diamond Vitrified Bond Wheel is meticulously engineered for precision polishing applications, especially within the semiconductor and electronics industries. The vitrified bond offers exceptional rigidity and shape retention, ensuring consistent polishing performance, even under demanding conditions. With outstanding thermal stability, this wheel minimizes the risk of thermal damage to the workpiece, allowing for a superior surface finish with minimal chipping.
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Features
- Wet Grinding
- Stability
- Precision
- Heat Resistance
- Material Removal
- Durability
- Surface Finish
Technical Specs
Diamond grit size, defined based on the drawing/blueprint, will determine whether the tool is used for polishing.
Range of Applications
Advance Electronics Parts
Ceramic Substrate Manufacture
LED/LCD
IC Packaging
Micro LED/OLED
MEMC Device
PCB
Si SiCand Sapphire Wafer
Material Suitability
Ceramic Tile
Glass / Optics
Silicon / Silicon Carbide
Sapphire, Quartz & Other Crystals
Other Advanced Materials
Non-Ferrous Metals
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